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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
    BGA1
    Tessera1
    ball grid array1
    Nexgen1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    chip scale technology1
    compliant chip1
    compliant layer1
    NxGen1
    Nexgen Elect1
    Nexgen Electronics1
    Nxgen Elect1
    NxGen Electronics1
    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  2. Tango Systems, Inc. - Innovative and Cost Effective PVD Solutions

    Tango Systems designs, manufactures, markets and services high volume manufacturing PVD systems that enable advanced IC packaging PVD sputtering tools
    MEMS1
    ICP1
    TSV1
    BSM1
    die attach1
    UBM1
    Pb-Free1
    Integrated Passives1
    PVD system1
    nanofilms1
    advanced IC packaging1
    Advanced Silicon1
    backside metallization1
    Au Bumps0
    Axcela0
    D-Source0

    www.tangosystemsinc.com - 2009-02-08

  3. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  4. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    semiconductor2
    MEMS1
    electroplating1
    etch1
    PVD1
    Cirrus1
    Stratus1
    CVD1
    Nimbus1
    flip chip1
    flipchip1
    UBM1
    flip-chip1
    electrodeposition1
    integrated passives1
    sputter deposition1
    wafer-level packaging1
    backside metallization1
    thin wafer processing1
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

  5. Marketron - Home

    Marketron represents electronic component manufactures.
    Epson2
    Crystals2
    SAW2
    KOA1
    Resistors1
    Inductors1
    Oscillators1
    Manufacturers Representative1
    VCXO1
    TCXO1
    OCXO1
    AVX1
    Manufacturers Reps1
    LTCC1
    MLCC1
    Chip Resistors1
    Resistor Networks1
    Power Inductors1
    Integrated Passives1
    MELF1
    Thermal Sensors1
    Ceramic Chip1
    Marketron1
    Raltron1
    Golledge1
    Circuit Protectors1
    Fox Electronics1
    JITO1
    Cal Micro0
    Chip Networks0
    Fuse protection0

    www.marketron.co.uk - 2009-02-07

fold-over1 die stacking1 land grid array1 ball grid array1 csp1 chip scale package1 fine pitch bga1 fbga1

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